XCVM1302-1MSINBVB1024 AMD Ic Embedded
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manufacturer:
AMD
Description:
IC VERSALPRIME ACAP FPGA 1024BGA
Category:
Embedded
Specifications
Category:
Integrated Circuits (ICs)EmbeddedSystem On Chip (SoC)
Product Status:
Active
Peripherals:
DDR, DMA, PCIe
Primary Attributes:
Versal™ Prime FPGA, 70k Logic Cells
Series:
Versal™ Prime
Package:
Tray
Mfr:
AMD
Supplier Device Package:
1024-BGA (31x31)
Connectivity:
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Operating Temperature:
-40°C ~ 100°C (TJ)
Architecture:
MPU, FPGA
Package / Case:
1024-BFBGA
Number Of I/O:
316
RAM Size:
-
Speed:
600MHz, 1.3GHz
Core Processor:
Dual ARM® Cortex®-A72 MPCore™ With CoreSight™, Dual ARM®Cortex™-R5F With CoreSight™
Flash Size:
-
Highlight:
AMD ic embedded
,ic embedded Dual ARM
,XCVM1302-1MSINBVB1024
Introduction
Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ System On Chip (SOC) IC Versal™ Prime Versal™ Prime FPGA, 70k Logic Cells 600MHz, 1.3GHz 1024-BGA (31x31)
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